Multi-layered ceramic electronic component

ABSTRACT

A multi-layered ceramic electronic component has a ceramic body including dielectric layers and a plurality of internal electrodes opposing each other with the dielectric layers interposed therebetween. External electrodes are disposed on an exterior of the ceramic body and are electrically connected to the internal electrodes. Each external electrode includes an electrode layer electrically connected to internal electrodes, and a conductive resin layer arranged on the electrode layer. The conductive resin layer extends to first and second surface of the ceramic body, and a ratio of a thickness (Tb) of the conductive resin layer extending onto the first surface and the second surface of the ceramic body to a length (Lm) of a length direction margin portion of the ceramic body satisfies 2 to 29%.

CROSS-REFERENCE TO RELATED APPLICATION

This application is the continuation application of U.S. patentapplication Ser. No. 16/289,246 filed on Feb. 28, 2019, which claimsbenefit of priority to Korean Patent Application No. 10-2018-0160024filed on Dec. 12, 2018 in the Korean Intellectual Property Office, thedisclosures of which are incorporated herein by reference in theirentirety.

BACKGROUND 1. Field

The present disclosure relates to a multi-layered ceramic electroniccomponent, and more particularly, to a multi-layered ceramic electroniccomponent having excellent reliability.

2. Description of Related Art

In recent years, miniaturization, slimming and multifunctionalization ofelectronic products have demanded the miniaturization of multi-layeredceramic capacitors, and the mounting of multi-layered ceramic capacitorshas also become highly integrated.

A multi-layered ceramic capacitor, a type of electronic component, maybe mounted on a printed circuit board of various electronic products,for example, an imaging device such as a liquid crystal display (LCD) ora plasma display panel (PDP), a computer, a personal digital assistant(PDA), a mobile phone, and the like, and may serve to charge ordischarge electricity.

Such multi-layered ceramic capacitors may be used as components ofvarious electronic devices, due to having a relatively compact size, arelatively high capacitance, relative ease of mounting, and the like.

In the meantime, as interest in industry for electric/electroniccomponents has increased recently, multi-layered ceramic capacitors arealso required to have high reliability and high strength in order to beused in vehicles or infotainment systems.

In particular, since a high bending strength characteristic is desirablefor a multi-layered ceramic capacitor, it is advantageous to improve theinternal and external structures for improving bending properties.

SUMMARY

An aspect of the present disclosure is to provide a multi-layeredceramic electronic component, and more particularly, to provide amulti-layered ceramic electronic component having excellent reliability.

According to an aspect of the present disclosure, a multi-layeredceramic electronic component has a ceramic body including a dielectriclayer, and a plurality of internal electrodes opposing each other withthe dielectric layer interposed therebetween, and including first andsecond surfaces opposing each other in a first direction, third andfourth surfaces connected to the first and second surfaces and opposingeach other in a second direction, and fifth and sixth surfaces connectedto the first to fourth surfaces and opposing each other in a thirddirection. An external electrode is disposed on an exterior of theceramic body and electrically connected to the internal electrodes. Theceramic body includes an active portion including the plurality ofinternal electrodes opposing each other with the dielectric layerinterposed therebetween, to form capacitance, and cover portions formedabove and below the active portion. Each external electrode includes anelectrode layer electrically connected to the internal electrode, and aconductive resin layer arranged on the electrode layer, the conductiveresin layer extending to the first surface and the second surface of theceramic body. A ratio of a thickness (Tb) of the conductive resin layerextending to the first surface and the second surface of the ceramicbody to a length (Lm) of a length direction margin portion of theceramic body satisfies 2 to 29%.

According to another aspect of the present disclosure, a multi-layeredceramic electronic component has a ceramic body including a dielectriclayer, and a plurality of first and second internal electrodes opposingeach other with the dielectric layer interposed therebetween, andincluding first and second surfaces opposing each other in a firstdirection, third and fourth surfaces connected to the first and secondsurfaces and opposing each other in a second direction, and fifth andsixth surfaces connected to the first to fourth surfaces and opposingeach other in a third direction. First and second external electrodesare disposed on an exterior of the ceramic body and electricallyconnected to the first and second internal electrodes, respectively. Theceramic body includes an active portion including the plurality of firstand second internal electrodes opposing each other with the dielectriclayer interposed therebetween, to form capacitance, and cover portionsformed above and below the active portion. The first and second externalelectrodes include first and second electrode layers electricallyconnected to the first and second internal electrodes, respectively, andfirst and second conductive resin layers arranged on the first andsecond electrode layers, the first and second conductive resin layersextending to the first surface and the second surface of the ceramicbody. A length of a region in which the first and second conductiveresin layers extend to the first surface and the second surface of theceramic body is greater than a length of a region in which the first andsecond electrode layers extend to the first surface and the secondsurface of the ceramic body. A ratio of a thickness (Tb) of the firstand second conductive resin layers extending to the first surface andthe second surface of the ceramic body to a length (Lm) of a lengthdirection margin portion of the ceramic body satisfies 2 to 29%.

According to further aspect of the present disclosure, a multi-layeredceramic electronic component has a body including pluralities of firstand second internal electrodes alternately stacked with each other withdielectric layers interposed therebetween, the first and second internalelectrodes having first ends extending to first and second opposingsurfaces of the body, respectively, and having second ends opposite tothe first ends and spaced apart from the second and first opposingsurfaces, respectively. First and second external electrodes aredisposed on the first and second opposing surfaces of the body,respectively, and extend on to third and fourth surfaces opposing eachother in a stacking direction of the internal electrodes. Each of thefirst and second external electrodes includes an electrode layerextending by a first distance over the third and fourth surfaces, and aconductive resin layer disposed on the electrode layer and extending bya second distance greater than the first distance over the third andfourth surfaces. A ratio of a thickness (Tb) of the conductive resinlayer on the third and fourth surfaces, to a length (Lm) by which thesecond ends of the first and second internal electrodes are spaced apartfrom the second and first opposing surfaces, respectively, is in therange of 2% to 29%.

BRIEF DESCRIPTION OF DRAWINGS

The above and other aspects, features, and advantages of the presentdisclosure will be more clearly understood from the following detaileddescription, taken in conjunction with the accompanying drawings, inwhich:

FIG. 1 is a perspective view illustrating a multi-layered ceramiccapacitor according to an embodiment of the present disclosure;

FIG. 2 is a schematic view illustrating a ceramic body according to anembodiment of the present disclosure;

FIG. 3 is a cross-sectional view taken along line I-I′ in FIG. 1; and

FIG. 4 is an enlarged view of portion B in FIG. 3.

DETAILED DESCRIPTION

The embodiments of the present disclosure may be modified to havevarious other forms, and the scope of the present disclosure is notlimited to the embodiments described below. Embodiments of the presentdisclosure may be also provided to more fully describe the presentdisclosure to those skilled in the art. Therefore, the shapes and sizesof the elements in the drawings may be exaggerated for clarity, and theelements denoted by the same reference numerals in the drawings are thesame elements.

Throughout the specification, when an element is referred to as“comprising”, it means that it may include other elements as well,rather than excluding other elements unless specifically statedotherwise.

In order to clearly illustrate the present disclosure, parts not relatedto the description are omitted, and thicknesses are enlarged in order toclearly represent layers and regions, and similar portions are denotedby similar reference numerals throughout the specification.

Hereinafter, preferred embodiments of the present disclosure will bedescribed with reference to the accompanying drawings.

FIG. 1 is a perspective view illustrating a multi-layered ceramiccapacitor according to an embodiment of the present disclosure.

FIG. 2 is a schematic view illustrating a ceramic body according to anembodiment of the present disclosure.

FIG. 3 is a cross-sectional view taken along line I-I′ in FIG. 1.

Referring to FIGS. 1 to 3, a multi-layered ceramic electronic device 100according to an embodiment of the present disclosure may include aceramic body 110 including a plurality of dielectric layers 111, and aplurality of internal electrodes 121 and 122 opposing each other withthe dielectric layers 111 interposed therebetween, and including firstand second surfaces S1 and S2 opposing each other in a first direction,third and fourth surfaces S3 and S4 connected to the first and secondsurfaces S1 and S2 and opposing each other in a second direction, andfifth and sixth surfaces S5 and S6 connected to the first to fourthsurfaces S1 to S4 and opposing each other in a third direction. Externalelectrodes 131 or 132 are disposed on an exterior of the ceramic body110 and electrically connected to the internal electrodes 121 and 122,respectively. The ceramic body 110 includes an active portion Aincluding the plurality of internal electrodes 121 and 122 opposing eachother with the dielectric layers 111 interposed therebetween, to formcapacitance, and cover portions C1 and C2 formed above and below theactive portion A in a stacking direction of the internal electrodes.

Hereinafter, an illustrative multi-layered ceramic electronic componentaccording to an embodiment of the present disclosure will be described,but the present disclosure is not limited thereto.

In a multi-layered ceramic capacitor according to an embodiment of thepresent disclosure, a ‘length direction’ of the multi-layered ceramiccapacitor refers to an ‘L’ direction of FIG. 1, a ‘width direction’ ofthe multi-layered ceramic capacitor refers to a ‘W’ direction of FIG. 1,and a ‘thickness direction’ of the multi-layered ceramic capacitorrefers to a ‘T’ direction of FIG. 1. The ‘thickness direction’ may beused in the same sense as the direction in which the dielectric layersare stacked up, e.g., as a ‘layering direction.’

In an embodiment of the present disclosure, a shape of the ceramic body110 is not particularly limited in shape, but may be a hexahedral shape,as illustrated.

The ceramic body 110 may include first and second surfaces S1 and S2opposing each other in a first direction, third and fourth surfaces S3and S4 connected to the first and second surfaces S1 and S2 and opposingeach other in a second direction, and fifth and sixth surfaces S5 and S6connected to the first to fourth surfaces S1 to S4 and opposing eachother in a third direction.

The first surface S1 and the second surface S2 may be defined to faceeach other in a thickness direction of the ceramic body 110, i.e., in afirst direction, the third surface S3 and the fourth surface S4 may bedefined to face each other in a length direction of the ceramic body110, i.e., in a second direction, and the fifth surface S5 and the sixthsurface S6 may be defined to face each other in a width direction of theceramic body 110, i.e., in a third direction.

One end of each of the plurality of internal electrodes 121 and 122formed in the ceramic body 110 may be exposed to the third surface S3 orthe fourth surface S4 of the ceramic body.

The internal electrodes 121 and 122 may have a first internal electrode121 and a second internal electrode 122, having different polarities,disposed in pairs in the body 110.

One end of the first internal electrode 121 may be exposed to the thirdsurface S3, and one end of the second internal electrode 122 may beexposed to the fourth surface S4.

The other ends of the first internal electrode 121 and the secondinternal electrode 122 may be formed at or spaced apart by regularintervals from the fourth surface S4 or the third surface S3. Morespecific details thereof will be described later.

The first and second external electrodes 131 and 132 may be formed onthe third surface S3 and the fourth surface S4 of the ceramic body, andmay be electrically connected to the internal electrodes 121 and 122,respectively.

According to an embodiment of the present disclosure, a raw material forforming the dielectric layer 111 is not particularly limited as long assufficient electrostatic capacitance may be obtained. For example, abarium titanate-based material, a complex lead perovskite-basedmaterial, a strontium titanate-based material, or the like may be used.

Various ceramic additives, organic solvents, plasticizers, binders,dispersants, and the like, may be added including barium titanate(BaTiO₃) powder, or the like, materials for forming the dielectric layer111, in accordance with the purpose of the present disclosure.

The ceramic body 110 may include an active portion A serving as aportion contributing to capacitance formation of the capacitor, and anupper cover portion C1 and a lower cover portion C2 formed respectivelyabove and below (in a stacking direction) the active portion A as upperand lower margin portions.

The active portion A may be formed by repeatedly stacking the pluralityof first and second inner electrodes 121 and 122 with the dielectriclayers 111 interposed therebetween.

The upper cover portion C1 and the lower cover portion C2 may have thesame material and configuration as those of the dielectric layer 111,except that they do not include internal electrodes.

For example, the upper cover portion C1 and the lower cover portion C2may include a ceramic material, for example, a barium titanate(BaTiO₃)-based ceramic material.

The upper cover portion C1 and the lower cover portion C2 may be formedby stacking a single dielectric layer or two or more dielectric layerson upper and lower surfaces of the active portion A in the verticaldirection, and may basically serve to prevent the internal electrodefrom being damaged by physical or chemical stress.

The material forming the first and second internal electrodes 121 and122 is not particularly limited, and may be formed using a conductivepaste including one or more of silver (Ag), lead (Pb), platinum (Pt),nickel (Ni), and copper (Cu).

A multi-layered ceramic capacitor according to an embodiment of thepresent disclosure may include a first external electrode 131electrically connected to the first internal electrode(s) 121 and asecond external electrode 132 electrically connected to the secondinternal electrode(s) 122.

The first and second external electrodes 131 and 132 may be electricallyconnected to the first and second internal electrodes 121 and 122 toform electrostatic capacitance, and the second external electrode 132may be connected to a potential different from that of the firstexternal electrode 131.

The first and second external electrodes 131 and 132 may be respectivelyarranged on the third surface S3 and the fourth surface S4 in the lengthdirection, i.e., in the second direction of the ceramic body 110, butmay extend into the first surface S1 and the second surface S2 in thethickness direction, i.e., in the first direction of the ceramic body110.

The external electrodes 131 and 132 may be disposed on an exterior ofthe ceramic body 110, and may include electrode layers 131 a and 132 aelectrically connected to and in direct contact with the internalelectrodes 121 and 122, and conductive resin layers 131 b and 132 barranged on the electrode layers 131 a and 132 a.

In particular, the first external electrode 131 may be disposed on thethird surface S3 in the length direction, i.e., in the second directionof the ceramic body 110, and may include a first electrode layer 131 adisposed directly on the third surface S3 to be electrically connectedto the first internal electrode(s) 121, and a first conductive resinlayer 131 b disposed on the first electrode layer 131 a.

Further, the second external electrode 132 may be disposed on the fourthsurface S4 in the length direction, i.e., in the second direction of theceramic body 110, and electrically connected to the second internalelectrode(s) 122, and may include a second electrode layer 132 adisposed directly on the fourth surface S4 to be electrically connectedto the second internal electrode(s) 122, and a second conductive resinlayer 132 b disposed on the second electrode layer 132 a.

The electrode layers 131 a and 132 a may include a conductive metal anda glass.

The conductive metal used for the electrode layers 131 a and 132 a isnot particularly limited as long as it is a material that may beelectrically connected to the internal electrode for formation ofelectrostatic capacitance. For example, the conductive metal may be oneor more selected from the group consisting of copper (Cu), silver (Ag),nickel (Ni), and alloys thereof.

The electrode layers 131 a and 132 a may be formed by applying aconductive paste prepared by adding glass frit to a powder of theconductive metal, and then firing the paste.

The conductive resin layers 131 b and 132 b may be formed on theelectrode layers 131 a and 132 a, and may be formed to completely coverthe electrode layers 131 a and 132 a.

A base resin included in the conductive resin layers 131 b and 132 b isnot particularly limited as long as it has bondability and impactabsorbing ability, and may be mixed with the conductive metal powder toform a paste. For example, the base resin may include an epoxy resin.

The conductive metal included in the conductive resin layers 131 b and132 b is not particularly limited as long as it is a material that maybe electrically connected to the electrode layers 131 a and 132 a. Forexample, the conductive metal may include one or more selected from thegroup consisting of copper (Cu), silver (Ag), nickel (Ni), and alloysthereof.

The conductive resin layers 131 b and 132 b may overhang an edge of theelectrode layers 131 a and 132 a so as to extend to the first surface S1and the second surface S2 of the ceramic body 110. A ratio of thethickness (Tb) of the conductive resin layers 131 b and 132 b extendingonto the first surface S1 and the second surface S2 of the ceramic body110 to a length (Lm) of a length direction margin portion (a lengthdirection portion in which only the first internal electrodes 121overlap each other, or a length direction portion in which only thesecond internal electrodes 122 overlap each other) of the ceramic body110 may satisfy 2 to 29%.

According to an embodiment of the present disclosure, the conductiveresin layers 131 b and 132 b may overhang an edge of the electrodelayers 131 a and 132 a so as to extend to the first surface S1 and thesecond surface S2 of the ceramic body 110. A ratio of the thickness (Tb)of the conductive resin layers 131 b and 132 b extending onto the firstsurface S1 and the second surface S2 of the ceramic body 110 to a length(Lm) of a length direction margin portion of the ceramic body 110 maysatisfy 2 to 29%. Therefore, bending strength of the multi-layeredceramic capacitor may be improved.

The thickness (Tb) of the conductive resin layers 131 b and 132 bextending to the first surface S1 and the second surface S2 of theceramic body 110 may be a maximum thickness among thicknesses of theconductive resin layers 131 b and 132 b.

Meanwhile, the length (Lm) of the length direction margin portions ofthe ceramic body 110 may be a length extending from one of the thirdsurface S3 and the fourth surface S4 of the ceramic body 110 to an endportion (e.g., a proximate end) of a region in which the plurality ofinternal electrodes 121 and 122 disposed in the active portion A overlapwith each other.

Generally, in evaluating bending strength characteristics of themulti-layered ceramic capacitor, the number of stacked dielectric layerson which the internal electrodes are printed, and the degree ofapplication of the conductive resin layer, which is a secondaryelectrode in the external electrodes, may be important factors forensuring the bending strength.

In particular, as the number of stacked layers increases, a fraction ofthe internal electrode may be relatively high to increase the bendingstrength. Meanwhile, when a fraction of the internal electrode isrelatively low, the bending structure may be deteriorated.

Meanwhile, when the fraction of the internal electrode affects theimprovement of the strength of the multi-layered ceramic capacitor, theconductive resin layer, which is the secondary electrode of the externalelectrodes, may be applied as an apparatus for absorbing or solving thestress by the external action. Therefore, there has recently been atrial to achieve a certain level of bending strength by increasing anamount of the application.

In an embodiment of the present disclosure, a ratio of a thickness (Tb)of the conductive resin layers 131 b and 132 b extending to the firstsurface S1 and the second surface S2 of the ceramic body 110 and alength (Lm) of the length direction margin portion, which is a region inwhich a fraction of (or a number of) the internal electrode in theceramic body 110 is relatively low, may be controlled. Therefore,bending strength of the multi-layered ceramic capacitor may be improved.

For example, a ratio of the thickness (Tb) of the conductive resinlayers 131 b and 132 b extending to the first surface S1 and the secondsurface S2 of the ceramic body 110 to a length (Lm) of a lengthdirection margin portion of the ceramic body 110 may be controlled tosatisfy 2 to 29%. Therefore, bending strength of the multi-layeredceramic capacitor may be improved.

When a ratio of the thickness (Tb) of the conductive resin layers 131 band 132 b extending to the first surface S1 and the second surface S2 ofthe ceramic body 110 to a length (Lm) of the length direction marginportion of the ceramic body 110 is less than 2%, defects may occur inmeasuring bending strength at 5 mm, and no effect enhancing bendingstrength may be exerted.

When a ratio of the thickness (Tb) of the conductive resin layers 131 band 132 b extending to the first surface S1 and the second surface S2 ofthe ceramic body 110 to a length (Lm) of a length direction marginportion of the ceramic body 110 exceeds 29%, the external electrode mayhave a relatively high thickness. Therefore, reliability may be lowereddue to poor appearance of the finished product, occurrence of voids inthe conductive resin layer, and the like.

FIG. 4 is an enlarged view of portion B in FIG. 3.

Referring to FIG. 4, in a multi-layered ceramic electronic componentaccording to an embodiment of the present disclosure, a thickness (td)of the dielectric layer 111 (e.g., a distance between two adjacentinternal electrodes 121 and 122) and a thickness (te) of the internalelectrodes 121 and 122 (e.g., a distance between two adjacent dielectriclayers 111 having an internal electrode therebetween) may satisfy therelationship td>2×te.

For example, according to an embodiment of the present disclosure, thethickness (td) of the dielectric layer 111 may be larger than twice thethickness (te) of the internal electrodes 121 and 122.

Generally, electronic components in a high voltage electric/electronicdevice may have a reliability problem due to a decrease in dielectricbreakdown voltage under a relatively high voltage environment.

The multi-layered ceramic capacitor according to an embodiment of thepresent disclosure may improve dielectric breakdown voltagecharacteristics by increasing the thickness (td) of the dielectric layer111 to be larger than twice the thickness (te) of the internalelectrodes 121 and 122 to prevent a decrease in dielectric breakdownvoltage under a relatively high voltage environment, and by increasing athickness of the dielectric layer which is a distance between theinternal electrodes.

When the thickness (td) of the dielectric layer 111 is twice or lessthan the thickness (te) of the internal electrodes 121 and 122, thedielectric breakdown voltage may decrease due to a relatively thindielectric layer, which is a distance between the internal electrodes.

The thickness (te) of the internal electrode may be less than 1 μm, andthe thickness (td) of the dielectric layer may be less than 2.8 μm, butis not necessarily limited thereto.

The multi-layered ceramic electronic component 100 according to anotherembodiment of the present disclosure may include a ceramic body 110including dielectric layers 111, and pluralities of first and secondinternal electrodes 121 and 122 opposing each other with the dielectriclayers 111 interposed therebetween, and including first and secondsurfaces S1 and S2 opposing each other in a first direction, third andfourth surfaces S3 and S4 connected to the first and second surfaces S1and S2 and opposing each other in a second direction, and fifth andsixth surfaces S5 and S6 connected to the first to fourth surfaces S1 toS4 and opposing each other in a third direction; and first and secondexternal electrodes 131 and 132 disposed on an exterior of the ceramicbody 110 and electrically connected to the first and second internalelectrodes 121 and 122, respectively. The ceramic body 110 includes anactive portion A including the pluralities of first and second internalelectrodes 121 and 122 opposing each other with the dielectric layers111 interposed therebetween, to form capacitance, and cover portions C1and C2 formed above and below the active portion A. The first and secondexternal electrodes 131 and 132 include first and second electrodelayers 131 a and 132 a electrically connected to and contacting thefirst and second internal electrodes 121 and 122, respectively, andfirst and second conductive resin layers 131 b and 132 b arranged on thefirst and second electrode layers 131 a and 132 a. The first and secondconductive resin layers 131 b and 132 b extend to the first surface S1and the second surface S2 of the ceramic body 110, and a length of aregion in which the first and second conductive resin layers 131 b and132 b extend to (and over) the first surface S1 and the second surfaceS2 of the ceramic body 110 is greater than a length of a region in whichthe first and second electrode layers 131 a and 132 a extend onto thefirst surface S1 and the second surface S2 of the ceramic body 110, anda ratio of a thickness (Tb) of the first and second conductive resinlayers 131 b and 132 b extending onto the first surface S1 and thesecond surface S2 of the ceramic body 110 to a length (Lm) of a lengthdirection margin portion of the ceramic body 110 satisfies 2 to 29%.

In the description of the multi-layered ceramic electronic componentaccording to another embodiment of the present disclosure, the sameparts as those of the multi-layered ceramic electronic componentaccording to the embodiment of the present disclosure described abovemay be omitted here to avoid redundant explanations.

According to another embodiment of the present disclosure, a length of aregion in which the first and second conductive resin layers 131 b and132 b extend to the first surface S1 and the second surface S2 of theceramic body 110 (e.g., a length from the third surface S3 to thefurthest point of the first conductive resin layer 131 b on the firstand second surfaces S1 and S2 along the length direction, or a lengthfrom the fourth surface S4 to the furthest point of the secondconductive resin layer 132 b on the first and second surfaces S1 and S2along the length direction) may be greater than a length of a region inwhich the first and second electrode layers 131 a and 132 a extend tothe first surface S1 and the second surface S2 of the ceramic body 110(e.g., a length from the third surface S3 to the furthest point of thefirst electrode layer 131 a on the first and second surfaces S1 and S2along the length direction, or a length from the fourth surface S4 tothe furthest point of the second electrode layer 132 a on the first andsecond surfaces S1 and S2 along the length direction).

For example, the first and second conductive resin layers 131 b and 132b may be formed on the first and second electrode layers 131 a and 132a, respectively, and may be formed to completely cover the first andsecond electrode layers 131 a and 132 a by extending over ends of thefirst and second electrode layers 131 a and 132 a to come into contactwith the first and second surfaces S1 and S2.

Therefore, a length of a region in which the first and second conductiveresin layers 131 b and 132 b extend to the first surface S1 and thesecond surface S2 of the ceramic body 110 may be disposed to be greaterthan a length of a region in which the first and second electrode layers131 a and 132 a extend to the first surface S1 and the second surface S2of the ceramic body 110.

The first and second external electrodes 131 and 132 may be disposed onan exterior of the ceramic body 110, and may include first and secondelectrode layers 131 a and 132 a electrically connected to the first andsecond internal electrodes 121 and 122, respectively, and first andsecond conductive resin layers 131 b and 132 b disposed on the first andsecond electrode layers 131 a and 132 a, respectively.

In particular, the first external electrode 131 may be disposed on thethird surface S3 in the length direction, i.e., in the second directionof the ceramic body 110, and may include a first electrode layer 131 aelectrically connected to (and physically contacting) the first internalelectrode 121, and a first conductive resin layer 131 b disposed on thefirst electrode layer 131 a.

Further, the second external electrode 132 may be disposed on the fourthsurface S4 in the length direction, i.e., in the second direction of theceramic body 110 and electrically connected to the second internalelectrode 122, and may include a second electrode layer 132 aelectrically connected to (and physically contacting) the secondinternal electrode 122, and a second conductive resin layer 132 bdisposed on the second electrode layer 132 a.

Hereinafter, a method of manufacturing a multi-layered ceramicelectronic component according to an embodiment of the presentdisclosure will be described, but the present disclosure is not limitedthereto.

A method of manufacturing a multi-layered ceramic electronic deviceaccording to an embodiment of the present disclosure may include firstlyapplying a slurry formed of a powder such as barium titanate (BaTiO₃) orthe like to a carrier film and drying the same to form a plurality ofceramic green sheets, to form a dielectric layer.

The ceramic green sheet may be prepared by mixing a ceramic powder, abinder, and a solvent to prepare a slurry, and by subjecting the slurryto a doctor blade method to forma sheet having a thickness of severalmicrometers.

Next, an internal electrode conductive paste having an average nickelparticle size of 0.1 to 0.2 μm and containing nickel powder of 40 to 50parts by weight may be provided.

The internal electrode conductive paste may be applied on the greensheet by a screen printing method to form internal electrodes, and thengreen sheets on which internal electrode patterns are arranged may bestacked to form a ceramic body 110.

Next, an electrode layer including one or more conductive metal selectedfrom the group consisting of copper (Cu), silver (Ag), nickel (Ni), andalloys thereof, and glass may be formed on an exterior of the ceramicbody.

The glass is not particularly limited, and a material having the samecomposition as glass used for manufacturing an external electrode of aconventional multi-layered ceramic capacitor may be used.

The electrode layer may be formed on the upper and lower surfaces andthe end portions of the ceramic body to be electrically connected to thefirst and second internal electrodes, respectively.

The electrode layer may contain 5% by volume or more of glass, based onthe conductive metal.

Next, a conductive resin composition may be applied on the electrodelayers 131 a and 132 a, and then cured, to form the conductive resinlayers 131 b and 132 b.

The conductive resin layers 131 b and 132 b may include one or moreconductive metal selected from the group consisting of copper (Cu),silver (Ag), nickel (Ni), and alloys thereof, and a base resin, and thebase resin may be an epoxy resin.

According to an embodiment of the present disclosure, the conductiveresin layer may be disposed to extend to the first surface and thesecond surface of the ceramic body, and a ratio of a thickness (Tb) ofthe first and second conductive resin layers 131 b and 132 b extendingto the first surface S1 and the second surface S2 of the ceramic body110 to a length (Lm) of a length direction margin portion of the ceramicbody 110 may satisfy 2 to 29%.

The thickness (Tb) of the first and second conductive resin layers 131 band 132 b extending to the first surface S1 and the second surface S2 ofthe ceramic body 110 may be a maximum thickness among thicknesses of theconductive resin layers 131 b and 132 b, and may be measuredsubstantially orthogonally to the first surface S1 and the secondsurface S2 of the ceramic body 110.

Meanwhile, the length (Lm) of the length direction margin portions ofthe ceramic body 110 may be a length covering from the third surface S3and the fourth surface S4 of the ceramic body 110 to an end portion of aregion in which the plurality of internal electrodes 121 and 122disposed in the active portion A overlap, and may be measured in alength direction substantially orthogonal to the third and fourthsurfaces.

Hereinafter, the occurrence frequency of bending cracks was measured inaccordance with a ratio of a thickness (Tb) of the first and secondconductive resin layers 131 b and 132 b extending to the first surfaceS1 and the second surface S2 of the ceramic body 110 to a length (Lm) ofa length direction margin portion of the ceramic body 110, and valuesthereof were reported in Table 1.

In the case of measuring the frequency of bending cracks, samples ofmulti-layered ceramic capacitor were mounted on a substrate. A distancefrom a central portion pressed by the bending was set to be 5 mm, andeach of the 60 samples was measured five times and was observed todetermine whether or not bending strength at 5 mm was guaranteed.

TABLE 1 Sample Tb/Lm A B C D E *1  1.0% 3/60 1/60 1/60 2/60 1/60 2 2.0%0/60 0/60 0/60 0/60 0/60 3 10.0% 0/60 0/60 0/60 0/60 0/60 4 15.0% 0/600/60 0/60 0/60 0/60 5 29.0% 0/60 0/60 0/60 0/60 0/60 *6  30.0% 0/60 0/600/60 0/60 0/60 *Comparative Example

Referring to Table 1, it can be seen that, in the cases of Samples 2 to5 in which a ratio of a thickness (Tb) of the first and secondconductive resin layers 131 b and 132 b extending to the first surfaceS1 and the second surface S2 of the ceramic body 110 to a length (Lm) ofa length direction margin portion of the ceramic body 110 satisfies 2 to29%, according to an embodiment of the present disclosure, bendingstrength at distances up to 5 mm may be satisfied.

In contrast, it can be seen that, in the case of Comparative Example 1in which a ratio of a thickness (Tb) of the first and second conductiveresin layers 131 b and 132 b extending to the first surface S1 and thesecond surface S2 of the ceramic body 110 to a length (Lm) of a lengthdirection margin portion of the ceramic body 110 is less than 2%,defects may occur in measuring bending strength at 5 mm, and no effectenhancing bending strength may be exerted.

In the case of Comparative Example 6 in which a ratio of a thickness(Tb) of the first and second conductive resin layers 131 b and 132 bextending to the first surface S1 and the second surface S2 of theceramic body 110 to a length (Lm) of a length direction margin portionof the ceramic body 110 exceeds 29%, bending strength characteristicsmay be satisfied, but the thickness of the external electrode may berelatively high. Therefore, reliability may be lowered due to poorappearance of the finished product, occurrence of voids in theconductive resin layer, and the like.

According to an embodiment of the present disclosure, the thickness (Tb)of the first and second conductive resin layers extending to the firstsurface and the second surface of the ceramic body to the length (Lm) ofthe length direction margin portion of the ceramic body may becontrolled. Therefore, bending strength may be improved and thereliability may be improved.

While exemplary embodiments have been shown and described above, it willbe apparent to those skilled in the art that modifications andvariations could be made without departing from the scope of the presentdisclosure as defined by the appended claims.

What is claimed is:
 1. A multi-layered ceramic electronic componentcomprising: a ceramic body including a plurality of dielectric layers,and a plurality of internal electrodes opposing each other with thedielectric layers interposed therebetween, and including first andsecond surfaces opposing each other in a first direction correspondingto a stacking direction of the internal electrodes, third and fourthsurfaces connected to the first and second surfaces and opposing eachother in a second direction, and fifth and sixth surfaces connected tothe first to fourth surfaces and opposing each other in a thirddirection; and external electrodes disposed on the third and fourthsurfaces on an exterior of the ceramic body and electrically connectedto the internal electrodes, wherein the ceramic body includes an activeportion including the plurality of internal electrodes opposing eachother with the dielectric layers interposed therebetween, to formcapacitance, and cover portions formed above and below the activeportion and free of the internal electrodes, each external electrodeincludes an electrode layer disposed on the third and fourth surfaces tobe electrically connected to at least some of the internal electrodes,and a conductive resin layer arranged on the electrode layer, theconductive resin layer extending to the first surface and the secondsurface of the ceramic body, a ratio of a thickness (Tb) of theconductive resin layer extending to the first surface and the secondsurface of the ceramic body to a length (Lm) of a length directionmargin portion of the ceramic body satisfies 2 to 29%, and wherein athickness (td) of the dielectric layers and a thickness (te) of theinternal electrodes are different each other.
 2. The multi-layeredceramic electronic component according to claim 1, wherein the thickness(Tb) of the conductive resin layer extending to the first surface andthe second surface of the ceramic body is a maximum thickness amongthicknesses of the conductive resin layer measured orthogonally to thefirst surface.
 3. The multi-layered ceramic electronic componentaccording to claim 1, wherein the length (Lm) of the length directionmargin portion of the ceramic body is a length, measured along thesecond direction, extending from the third surface or the fourth surfaceof the ceramic body to an end portion of a region in which the pluralityof internal electrodes disposed in the active portion overlap.
 4. Themulti-layered ceramic electronic component according to claim 1, whereinthe electrode layer comprises one or more conductive metal selected fromthe group consisting of copper (Cu), silver (Ag), nickel (Ni), andalloys thereof.
 5. The multi-layered ceramic electronic componentaccording to claim 1, wherein the conductive resin layer comprises oneor more conductive metal selected from the group consisting of copper(Cu), silver (Ag), nickel (Ni), and alloys thereof, and a base resin. 6.The multi-layered ceramic electronic component according to claim 1,wherein a thickness (te) of the internal electrodes is less than 1 μm.7. The multi-layered ceramic electronic component according to claim 1,wherein a thickness (td) of the dielectric layers is less than 2.8 μm.8. The multi-layered ceramic electronic component according to claim 1,wherein a thickness (td) of the dielectric layers and a thickness (te)of the internal electrodes satisfy the relationship td>2×te.
 9. Amulti-layered ceramic electronic component comprising: a ceramic bodyincluding a plurality of dielectric layers, and pluralities of first andsecond internal electrodes opposing each other with the dielectriclayers interposed therebetween, and including first and second surfacesopposing each other in a first direction, third and fourth surfacesconnected to the first and second surfaces and opposing each other in asecond direction, and fifth and sixth surfaces connected to the first tofourth surfaces and opposing each other in a third direction; and firstand second external electrodes disposed on an exterior of the ceramicbody and electrically connected to the first and second internalelectrodes, respectively, wherein the ceramic body includes an activeportion including the plurality of first and second internal electrodesopposing each other with the dielectric layers interposed therebetween,to form capacitance, and cover portions formed above and below theactive portion in the first direction, the first and second externalelectrodes include first and second electrode layers electricallyconnected to the first and second internal electrodes, respectively, andfirst and second conductive resin layers arranged on the first andsecond electrode layers, the first and second conductive resin layersextending to the first surface and the second surface of the ceramicbody, a length of a region in which the first and second conductiveresin layers extend over the first surface and the second surface of theceramic body is greater than a length of a region in which the first andsecond electrode layers extend over the first surface and the secondsurface of the ceramic body, a ratio of a thickness (Tb) of the firstand second conductive resin layers extending to the first surface andthe second surface of the ceramic body to a length (Lm) of a lengthdirection margin portion of the ceramic body satisfies 2 to 29%, whereina thickness (td) of the dielectric layers and a thickness (te) of theinternal electrodes are different each other.
 10. The multi-layeredceramic electronic component according to claim 9, wherein the thickness(Tb) of the conductive resin layers extending to the first surface andthe second surface of the ceramic body is a maximum thickness amongthicknesses of the conductive resin layers measured orthogonally to thefirst surface.
 11. The multi-layered ceramic electronic componentaccording to claim 9, wherein the length (Lm) of the length directionmargin portion of the ceramic body is a length, measured in the seconddirection along which the third and fourth surfaces are opposed,extending from the third surface or the fourth surface of the ceramicbody to an end portion of a region in which the first and secondinternal electrodes disposed in the active portion overlap.
 12. Themulti-layered ceramic electronic component according to claim 9, whereineach of the first and second electrode layers comprises one or moreconductive metal selected from the group consisting of copper (Cu),silver (Ag), nickel (Ni), and alloys thereof.
 13. The multi-layeredceramic electronic component according to claim 9, wherein each of thefirst and second conductive resin layers comprises one or moreconductive metal selected from the group consisting of copper (Cu),silver (Ag), nickel (Ni), and alloys thereof, and a base resin.
 14. Themulti-layered ceramic electronic component according to claim 9, whereina thickness (te) of the internal electrodes is less than 1 μm.
 15. Themulti-layered ceramic electronic component according to claim 9, whereina thickness (td) of the dielectric layers is less than 2.8 μm.
 16. Themulti-layered ceramic electronic component according to claim 9, whereina thickness (td) of the dielectric layers and a thickness (te) of theinternal electrodes satisfy the relationship td>2×te.
 17. Amulti-layered ceramic electronic component comprising: a body includingpluralities of first and second internal electrodes alternately stackedwith each other with dielectric layers interposed therebetween, thefirst and second internal electrodes having first ends extending tofirst and second opposing surfaces of the body, respectively, and havingsecond ends opposite to the first ends and spaced apart from the secondand first opposing surfaces, respectively; and first and second externalelectrodes disposed on the first and second opposing surfaces of thebody, respectively, and extending on to third and fourth surfacesopposing each other in a stacking direction of the internal electrodes,wherein each of the first and second external electrodes includes anelectrode layer extending by a first distance over the third and fourthsurfaces, and a conductive resin layer disposed on the electrode layerand extending by a second distance greater than the first distance overthe third and fourth surfaces, a ratio of a thickness (Tb) of theconductive resin layer on the third and fourth surfaces, to a length(Lm) by which the second ends of the first and second internalelectrodes are spaced apart from the second and first opposing surfaces,respectively, is in the range of 2% to 29%, and wherein a thickness (td)of the dielectric layers and a thickness (te) of the internal electrodesare different each other.
 18. The multi-layered ceramic electroniccomponent according to claim 17, wherein the thickness (Tb) of theconductive resin layer is a maximum thickness of the conductive resinlayer measured orthogonally to the third surface.
 19. The multi-layeredceramic electronic component according to claim 17, wherein a thickness(te) of the internal electrodes is less than 1 μm, and a thickness (td)of the dielectric layers is less than 2.8 μm.
 20. The multi-layeredceramic electronic component according to claim 17, wherein a thickness(td) of the dielectric layers and a thickness (te) of the internalelectrodes satisfy the relationship td>2×te.